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TGIC

Chemical Formula: C12H15N3O6
CAS#: 2451-62-9

Our TGIC is manufactured in Japan, offering those without a secondary source a chance to derisk from China only sourcing. We offer different grades all of which are high quality and offer superior finish.

Applications

  • Powder coating
  • Transparent encapsulate for electronics
  • Semiconductor encapsulate
  • PCB applications

Packing

20 kg Paper Bags

Specification

TDS (Please contact us)

Safety Information

SDS (Please contact us)

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